Quik-Pak, Agile Microwave Technology and OMMIC Verify RF-Capable Packaging Solutions for 5G and IoT Semiconductor Devices

Collaboration Targets Packaging for Millimeter-Wave Applications

Quik-Pak Targets 5G, IoT with RF-Capable Packages

Quik-Pak, Agile Microwave Technology, and OMMIC successfully completed electrical RF characterization of OMMIC's millimeter-wave die to 43GHz in Quik-Pak OmPP packages and confirmed 5G-capable frequencies.
Quik-Pak, Agile Microwave Technology, and OMMIC successfully completed electrical RF characterization of OMMIC’s millimeter-wave die to 43GHz in Quik-Pak OmPP packages and confirmed 5G-capable frequencies.
Quik-Pak, Agile Microwave Technology, and OMMIC successfully completed electrical RF characterization of OMMIC’s millimeter-wave die to 43GHz in Quik-Pak OmPP packages and confirmed 5G-capable frequencies.

ESCONDIDO, Calif., Oct. 06, 2020 (GLOBE NEWSWIRE) — Quik-Pak, together with Agile Microwave Technology (AgileMwT) and OMMIC SA, today announced its line of JEDEC-compliant air-cavity QFN packages. The Quik-Pak open-molded plastic packages (OmPP®) are RF-capable to data rates of 43GHz, which will help speed availability of semiconductor devices for 5G and internet of things (IoT) millimeter-wave applications. The packages are available now from Quik-Pak as both off-the-shelf and custom offerings.

Each company contributed core technology to the project: Quik-Pak’s OmPP air-cavity open-molded QFN packages, AgileMwT’s interconnect design

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